Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis

@article{Liu2008ThermosonicWB,
  title={Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis},
  author={Yong Liu and Scott Irving and Timwah Luk},
  journal={IEEE Transactions on Electronics Packaging Manufacturing},
  year={2008},
  volume={31},
  pages={61-71}
}
In this paper, a transient nonlinear dynamic finite element framework is developed, which integrates the wire bonding process and the silicon devices under bond pad. Two major areas are addressed: one is the impact of assembly 1st wire bonding process and another one is the impact of device layout below the bond pad. Simulation includes the ultrasonic transient dynamic bonding process and the stress wave transferred to bond pad device and silicon in the 1st bond. The Pierce strain rate… CONTINUE READING
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