Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis

  title={Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis},
  author={Yong Liu and Scott Irving and Timwah Luk},
  journal={IEEE Transactions on Electronics Packaging Manufacturing},
In this paper, a transient nonlinear dynamic finite element framework is developed, which integrates the wire bonding process and the silicon devices under bond pad. Two major areas are addressed: one is the impact of assembly 1st wire bonding process and another one is the impact of device layout below the bond pad. Simulation includes the ultrasonic transient dynamic bonding process and the stress wave transferred to bond pad device and silicon in the 1st bond. The Pierce strain rate… CONTINUE READING
Highly Cited
This paper has 48 citations. REVIEW CITATIONS


Publications citing this paper.
Showing 1-10 of 37 extracted citations


Publications referenced by this paper.
Showing 1-9 of 9 references

Numerical study of wire bonding-analysis of interfacial deformation between wire and pad

  • Y. Takahashi, M. Inoue
  • ASME J. Electron. Packag., vol. 121, pp. 27–36…
  • 2002

Optimizing wire bonding processes for maximum factory portability

  • G. Gillotti, R. Cathcart
  • Proc. SEMICON West 2002 SEMI Technol. Symp.: Int…
  • 2002
1 Excerpt

Failure estimation of semiconductor chip during wire bonding process

  • T. Ikeda
  • ASME J. Electron. Packag., vol. 121, pp. 85–91…
  • 1999
2 Excerpts

Wire Bonding Microelectronics Materials, Processes, Reliability, Yield

  • G. Harman
  • New York: McGraw-Hill,
  • 1997
1 Excerpt

High reliability wire bonding by the 120 kHz frequency of ultrasonic

  • Y. Shirai
  • Proc. ICEMM, 1993, pp. 366–375.
  • 1993
1 Excerpt

Similar Papers

Loading similar papers…