Thermomigration Versus Electromigration in Microelectronics Solder Joints

@article{Abdulhamid2009ThermomigrationVE,
  title={Thermomigration Versus Electromigration in Microelectronics Solder Joints},
  author={Mohd F. Abdulhamid and Cemal Basaran and Yi-Shao Lai},
  journal={IEEE Transactions on Advanced Packaging},
  year={2009},
  volume={32},
  pages={627-635}
}
Competing mechanisms of electromigration and thermomigration in flip chip SnAgCu (SAC) solder joints were studied experimentally. A daisy chain of solder joints were stressed at 2.0 times 104 Amps/cm2, 2.4 times 104 Amps/cm2, and 2.8 times 104 Amps/cm2 current density levels at room temperature. In the test vehicle, some solder joints were exposed to a combination of electromigration and thermomigration, while some others were exposed to thermomigration alone. The changes in the intermetallic… Expand
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