Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

@article{Navarro2014ThermomechanicalAO,
  title={Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications},
  author={L. A. Navarro and X. Perpi{\~n}{\`a} and Philippe Godignon and Josep Montserrat and Viorel Banu and Miquel Vellveh{\'i} and Xavier Jord{\`a}},
  journal={IEEE Transactions on Power Electronics},
  year={2014},
  volume={29},
  pages={2261-2271}
}
Currently, the demand by new application scenarios of increasing operating device temperatures in power systems is requiring new die-attach materials with higher melting points and suitable thermomechanical properties. This makes the die-attach material selection, die-attaching process, and thermomechanical evaluation a real challenge in nowadays power packaging technology. This paper presents a comparative analysis of the thermomechanical performance of high-temperature die-attach materials… CONTINUE READING
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