Thermoelectric microcoolers for thermal management applications

@article{Fleurial1997ThermoelectricMF,
  title={Thermoelectric microcoolers for thermal management applications},
  author={J-P. Fleurial and Alex Borshchevsky and Martia A. Ryan and W. Phillips and Elzbieta Kolawa and T. Kacisch and Richard C. Ewell},
  journal={XVI ICT '97. Proceedings ICT'97. 16th International Conference on Thermoelectrics (Cat. No.97TH8291)},
  year={1997},
  pages={641-645}
}
  • J. FleurialA. Borshchevsky R. Ewell
  • Published 26 August 1997
  • Engineering
  • XVI ICT '97. Proceedings ICT'97. 16th International Conference on Thermoelectrics (Cat. No.97TH8291)
Due to the combined increase in circuit integration and chip power dissipation, there is a rapidly growing demand for solving the thermal management issues of power microelectronics. We are pursuing a novel thermal management approach that actively cools only the key high power devices by using a novel thermoelectric microcooler located under each of these power devices. In this way the device can operate at temperatures at or even below the ambient temperature of the heat sink, resulting in… 

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