Thermoelectric MEMS coolers
@article{Hilbert1999ThermoelectricMC, title={Thermoelectric MEMS coolers}, author={Claude Hilbert and Ryan Nelson and James P. Reed and Brent Lunceford and Anjan Somadder and Kang Hu and Uttam Ghoshal}, journal={Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)}, year={1999}, pages={117-122} }
To date the advantages of solid-state coolers such as high reliability, low-mechanical noise, and localized temperature control have often been negated by their inefficiency and the frequent need for multiple stages to achieve the desired temperature difference. While recent research on novel materials and low-dimensional structures raises the hope for improved performance, additional innovations are required to make solid-state cooling competitive. MCC is developing a novel implementation and…
Figures from this paper
10 Citations
Thermoelectric Cooler based on AGNR/Bi2Te3 and Control using Lab-VIEW
- Physics
- 2015
Beyond maximum operating temperature, failure of electronics components can be caused by package or junction over temperature. Malfunction of electronics package due to self heating or environmental…
A MEMS thermoelectric generator
- Engineering
- 2000
The demand for portable power is large and expanding. Technologies currently available to meet this demand include batteries, fuel cells, thermophotovoltaic (TPV) generators and thermoelectric (TE)…
Multistage thermoelectric micro coolers
- Engineering, PhysicsITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)
- 2002
Multistage thermoelectric coolers have been used for a long time because they offer a larger temperature difference than single stage thermoelectric coolers. MEMS technology leads to the possibility…
Systemic optimization of on-chip thermoelectric cooling
- Engineering2015 IEEE CPMT Symposium Japan (ICSJ)
- 2015
The proposed heuristic based method forms the basis for a generic optimization framework that enables system-level optimization of on-chip thermoelectric cooling in a commercial microprocessor package and finds a resultant cooling of up to 3°C at TDP delivered per core with a ~11% improvement in energy efficiency.
Thermoelectric Cool-Film Shear Stress Sensor
- EngineeringIEEE Electron Device Letters
- 2014
Hot-wire anemometers, being a robust and highly sensitive method for measuring flow properties, can be limited in sensitivity where locally increasing the temperature may induce measurement…
Thermoelectric cool-film flow sensor
- Engineering2012 IEEE Sensors
- 2012
Hemodynamics, specifically, fluid shear stress, plays an important role in the formation of arterial plaque known as atherosclerosis. For this application, hot-wire anemometers, being a robust and…
A poly-Si thermoelectric cooling device fabricated by surface micromachining technology
- EngineeringTRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)
- 2003
In this paper, for the first time, we present a novel on-chip integrated poly-Si TE (thermoelectric) cooling device fabricated by surface micromachining technology. The area of the bridge type…
Advanced electronic microcoolers
- PhysicsEighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)
- 1999
We discuss the design issues in the development of thermoelectric microcoolers for sub-200 K spot cooling applications. We start with the scaling theory for conventional microcooler configurations,…
A novel capillary-effect-based solder pump structure and its potential application for through-wafer interconnection
- Engineering
- 2009
Through-wafer electrical interconnection is a critical technology for advanced packaging. In this paper, a novel capillary-effect-based solder pump has been proposed and analyzed, which could produce…
References
SHOWING 1-7 OF 7 REFERENCES
Experiments with Peltier Junctions Pulsed with High Transient Currents
- Physics
- 1963
It was shown in a previous article by Landecker and Findlay that when transient currents are passed through a cooling Peltier junction the resulting transient temperature depends strongly on the…
Micromechanical switches fabricated using nickel surface micromachining
- Engineering
- 1997
Micromechanical switches have been fabricated in electroplated nickel using a four-level surface micromachining process. The simplest devices are configured with three terminals, a source, a drain,…
The Operation of Thermoelectric Elements in Non-Stationary Conditions
- Sov. Phys., Tech. Phys
- 1958