Thermodynamics and phase diagrams of lead-free solder materials

@article{Ipser2006ThermodynamicsAP,
  title={Thermodynamics and phase diagrams of lead-free solder materials},
  author={H. Ipser and H. Flandorfer and Christoph Luef and C. Schmetterer and U. Saeed},
  journal={Journal of Materials Science: Materials in Electronics},
  year={2006},
  volume={18},
  pages={3-17}
}
Many of the existing and most promising lead-free solders for electronics contain tin or tin and indium as a low melting base alloy with small additions of silver and/or copper. Layers of nickel or palladium are frequently used contact materials. This makes the two quaternary systems Ag–Cu–Ni–Sn and Ag–In–Pd–Sn of considerable importance for the understanding of the processes that occur during soldering and during operation of the soldered devices. The present review gives a brief survey on… Expand

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