Thermo-mechanical reliability assessment for 3D through-Si stacking

Abstract

The through silicon interconnection technology for stacked dies is a promising way of future package construction as it lowers yield risks of large die sizes and allows cost effective packaging solutions for heterogeneous electronic systems. Thermo-mechanical reliability dependent on processing and mounting steps as well as during testing are one major… (More)

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@article{Dudek2009ThermomechanicalRA, title={Thermo-mechanical reliability assessment for 3D through-Si stacking}, author={Rainer Dudek and B. Bramer and R. Irsigler and Sven Rzepka and Bernd Michel}, journal={EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems}, year={2009}, pages={1-7} }