Thermo-mechanical fatigue life evaluation for Sn-Pb and Sn-Ag solders


This paper describes a new thermo-mechanical fatigue (TMF) machine developed for solders and discusses TMF characteristics of lead and lead-free solders. Isothermal low cycle fatigue (LCF) tests were performed using Sn-37Pb, Sn-3.5Ag and Sn-3.0Ag-0.5Cu solders at 253K and 353K and in-phase and out-of-phase TMF tests using the same solders at the temperature… (More)


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