Thermo-mechanical design of fan-out wafer level package for power converter module


In this paper, thermo-mechanical simulations including wafer level warpage, thermal cycle and power cycle were conducted for the fan-out wafer level package (FOWLP) test vehicle of power converter module. From the simulation results, the wafer level warpage of 8 inch molded wafer can achieve the warpage target of lower than 1mm during the process flow from… (More)


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