Thermo-mechanical design of fan-out wafer level package for power converter module

@article{Chen2017ThermomechanicalDO,
  title={Thermo-mechanical design of fan-out wafer level package for power converter module},
  author={Zhaohui Chen and Tang Gongyue and Lau Boon Long and Ding Mian Zhi and Eva Wai Leong Ching and Chai Tai Chong},
  journal={2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)},
  year={2017},
  pages={1-6}
}
In this paper, thermo-mechanical simulations including wafer level warpage, thermal cycle and power cycle were conducted for the fan-out wafer level package (FOWLP) test vehicle of power converter module. From the simulation results, the wafer level warpage of 8 inch molded wafer can achieve the warpage target of lower than 1mm during the process flow from after molding, after back side grinding to after RDL fabrication with low CTE epoxy molding compound (EMC). The simulation results also… CONTINUE READING