Thermal via placement in 3D ICs

  title={Thermal via placement in 3D ICs},
  author={Brent Goplen and Sachin S. Sapatnekar},
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promising way of mitigating thermal issues by lowering the thermal resistance of the chip itself. However, thermal vias take up valuable routing space, and therefore, algorithms are needed to minimize their usage while placing them in areas where they would make the greatest impact. With the developing technology of three… CONTINUE READING
Highly Influential
This paper has highly influenced a number of papers. REVIEW HIGHLY INFLUENTIAL CITATIONS
Highly Cited
This paper has 182 citations. REVIEW CITATIONS

9 Figures & Tables



Citations per Year

182 Citations

Semantic Scholar estimates that this publication has 182 citations based on the available data.

See our FAQ for additional information.