Thermal stress in bonded joints

@inproceedings{Chen1979ThermalSI,
  title={Thermal stress in bonded joints},
  author={William T. Chen and Charles W. Nelson},
  year={1979}
}
  • William T. Chen, Charles W. Nelson
  • Published 1979
  • Computer Science
  • This paper considers the stress distributions in bonded materials induced by differential expansion or contraction of these materials. The analytical approach is similar to the lap joint theories attributed to Volkersen and expanded by Goland and Reissner. Several simple and typical analytical models are presented to bring out the relative importance of different geometrical and material parameters and to give some insight into different modes in which the bonds might fail. 

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    who is retired, is at 610 Bassett Avenue, Endicott, New York 13760

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