Thermal reliability of fine pitch Cu-Cu bonding with self assembled monolayer (SAM) passivation for Wafer-on-Wafer 3D-Stacking

@article{Peng2011ThermalRO,
  title={Thermal reliability of fine pitch Cu-Cu bonding with self assembled monolayer (SAM) passivation for Wafer-on-Wafer 3D-Stacking},
  author={Li Peng and H. Y. Li and Dau Fatt Lim and Shan Gao and Chaoliang Tan},
  journal={2011 IEEE 61st Electronic Components and Technology Conference (ECTC)},
  year={2011},
  pages={22-26}
}
Three-dimensional integrated circuit (3D IC) is a technology that has the potential to overcome conventional scaling limits by reducing signal propagation delay and power consumption. Wafer-on-Wafer 3D-Stacking is a more practical option for high throughput manufacturing of 3D IC. It is important to ensure excellent electrical, mechanical and thermal… CONTINUE READING