Thermal modeling and analysis for Ceramic Quad Flat No-lead packages

@article{Bo2015ThermalMA,
  title={Thermal modeling and analysis for Ceramic Quad Flat No-lead packages},
  author={Peng Bo and Yang Zhentao and Zhao Lu},
  journal={2015 16th International Conference on Electronic Packaging Technology (ICEPT)},
  year={2015},
  pages={1489-1493}
}
In this paper, the steady equivalent thermal circuit model of Ceramic Quad Flat No-lead (CQFN) has been done. 3D model of CQFN48 was set up and analyzed by finite element method. The influencing factors of CQFN packages for thermal resistance (θJC) were pointed out. It is concluded that package thermal resistance can be reduced by reducing ceramic substrate… CONTINUE READING