Thermal design optimization of a package on package

@article{Menon2009ThermalDO,
  title={Thermal design optimization of a package on package},
  author={A. R. R. Menon and Saket Karajgikar and Dereje Agonafer},
  journal={2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium},
  year={2009},
  pages={329-335}
}
In the past decade, compact components such as Chip Scale Packages and flip chips were the work horses of miniaturization. However, emerging applications are now demanding even higher packaging density. In order to fulfill this requirement, three dimensional packaging was evolved. Advantages of three dimensional packaging structure include minimal conductor length and reduce speed limiting inter chip interconnects. In the past, this packaging approach was relegated to memory devices with… CONTINUE READING
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