Thermal cycling reliability of SnAgCu solder joints in WLCSP

@article{Zeng2014ThermalCR,
  title={Thermal cycling reliability of SnAgCu solder joints in WLCSP},
  author={Kejun Zeng and Amit Nangia},
  journal={2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)},
  year={2014},
  pages={503-511}
}
It has been widely reported in the literature that for packages that are required to pass thermal cycling test, the SnAgCu solder joints should have high Ag content. In this study, thermal cycling performance of a wafer level chip-scale package was evaluated with different combinations of high Ag solder (Sn3.9Ag0.6Cu) and low Ag solder (Sn1.2Ag0.5Cu) with thick and thin PCB. It was found that with the low Ag solder ball the package mounted on a thin PCB had better performance. Metallurgical… CONTINUE READING