Thermal cycling fatigue analysis of SAC387 solder joints

  title={Thermal cycling fatigue analysis of SAC387 solder joints},
  author={Chandra Williams and Kok Ee Tan and John H. L. Pang},
  journal={2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems},
In this study, finite element analysis (FEA) was used to simulate a thermal cycling test result for a PBGA assembly with Sn-3.8Ag-0.7Cu solder joints subject to thermal cycling of −40°C to +125°C. The PBGA assembly was modeled using a 3D-quarter 1/8th octant model of the PBGA assembly. Two constitutive models for the SAC387 solder were investigated using… CONTINUE READING