Thermal characterization of package-on-package (POP)

  title={Thermal characterization of package-on-package (POP)},
  author={Morris B. Bowers and Yeong J. Lee and Bennett Joiner and Niranjan Vijayaragavan},
  journal={2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium},
A study was initiated in order to thermally quantify the characteristics of package-on-package (POP), which has been deployed in multiple mobile devices in order to reduce board area and subsequently mobile device size [1, 2]. In most POP scenarios (see Figure 1), the memory package is stacked on top of a baseband or application processor and reflowed together. Thermal simulations were conducted for a POP package configuration following the test methods defined in the JEDEC [3] standards and… CONTINUE READING


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Publications referenced by this paper.
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