Thermal-aware steiner routing for 3D stacked ICs

  title={Thermal-aware steiner routing for 3D stacked ICs},
  author={Mohit Pathak and Sung Kyu Lim},
  journal={2007 IEEE/ACM International Conference on Computer-Aided Design},
In this paper, we present the first work on the Steiner routing for 3D stacked ICs. In the 3D Steiner routing problem, the pins are located in multiple device layers, which makes it more general than its 2D counterpart. Our algorithm consists of two steps: tree construction and tree refinement. Our tree construction algorithm builds a delay-oriented Steiner tree under a given thermal profile. We show that thermal-aware 3D tree construction involves the minimization of two-variable Elmore delay… CONTINUE READING
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