Thermal-aware kernel mapping for three-dimensional multi-mode channel decoding

@article{Lin2014ThermalawareKM,
  title={Thermal-aware kernel mapping for three-dimensional multi-mode channel decoding},
  author={Shu-Yen Lin and Cheng-Hung Lin and Ho-Yun Su},
  journal={2014 IEEE 3rd Global Conference on Consumer Electronics (GCCE)},
  year={2014},
  pages={630-631}
}
In this work, three thermal-aware kernel mappings are proposed for a three-dimensional multi-mode channel decoding architecture. The proposed kernel mappings can reduce the peak temperature and support different thermal and latency constraints. In our experiments, we show the peak temperature can be reduced from 16.2°C~33.8°C. Besides, we also demonstrate that different mapping is chosen under different thermal and latency constraints.