Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor

Abstract

In this paper, we propose a thermal-aware job allocation and scheduling algorithm for three-dimensional (3D) chip multiprocessor (CMP). The proposed algorithm assigns hot jobs to the cores close to the heat sink and cool jobs to the cores far from the heat sink, subject to thermal constraints. The direct effect of the proposed algorithm on a 3D-CMP system… (More)
DOI: 10.1109/ISQED.2010.5450547

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