Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems

@article{Sarvey2014ThermalAE,
  title={Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems},
  author={Thomas E. Sarvey and Yang Zhang and Yue Ping Zhang and Hanju Oh and Muhannad S. Bakir},
  journal={Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)},
  year={2014},
  pages={205-212}
}
Microfluidic cooling shows promise in cooling next generation 3D microsystems when integrated with through-silicon-vias. In this work, electrical and thermal effects of staggered micropin-fin heat sink dimensions are analyzed using deionized water. An experimental study of five different silicon micropin-fin arrays with a nominal height of 200 μm and diameters down to 30 μm was conducted at flow rates up to approximately 100mL/min and pressure drops up to approximately 200 kPa. The lowest… CONTINUE READING

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