Thermal analysis of 3D packaging with a simplified thermal resistance network model and finite element simulation

@article{Chen2010ThermalAO,
  title={Thermal analysis of 3D packaging with a simplified thermal resistance network model and finite element simulation},
  author={Zhaohui Chen and Xiaobing Luo and Sheng Liu},
  journal={2010 11th International Conference on Electronic Packaging Technology & High Density Packaging},
  year={2010},
  pages={737-741}
}
Analytical solution is established to calculate equivalent thermal resistances of the through silicon via (TSV) structure in both z direction and x y directions and is verified by the finite element simulation. The effects of the structural parameters such as the thickness of die, the diameter of copper via and the pitch of the copper via on the equivalent thermal conductivity of composite TSV structure have been investigated. It is found that the thermal conductivity in z direction increases… CONTINUE READING

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