Thermal analysis for cracks near interfaces between piezoelectric materials

Abstract

A crack of arbitrary size and orientation near bimaterial interfaces between dissimilar thermopiezoelectric materials is considered . A system of singular integral equations for the unknown thermal analog of dislocation density defined on the crack faces is derived by way of the Stroh's formulation and the thermoelectroelastic Green's fUflctions developed… (More)

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2 Figures and Tables