Thermal aging of molding compounds

Abstract

The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead… (More)

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@article{Jansen2010ThermalAO, title={Thermal aging of molding compounds}, author={K. M. B . Jansen and Janny de Vreugd and L. J. Ernst and C. Bohm}, journal={2010 11th International Conference on Electronic Packaging Technology & High Density Packaging}, year={2010}, pages={778-780} }