Thermal Performance Analysis for Packaging Configuration Design of Multifinger GaInP Collector-Up HBTs as Small High-Power Amplifiers

@article{Tseng2007ThermalPA,
  title={Thermal Performance Analysis for Packaging Configuration Design of Multifinger GaInP Collector-Up HBTs as Small High-Power Amplifiers},
  author={H. C. Tseng and P. H. Lee and J. H. Chou},
  journal={2007 8th International Conference on Electronic Packaging Technology},
  year={2007},
  pages={1-3}
}
A finite-element modeling (FEM) methodology is utilized to investigate the thermal performance of GaInP collector-up heterojunction bipolar transistors (C-up HBTs) with thermal-via packaging configurations. The thermal interaction between HBT fingers has been examined based on the temperature distribution phenomena in multifinger C-up HBTs. The results… CONTINUE READING