Thermal Modeling, Characterization and Management of On-Chip Networks

@article{Shang2004ThermalMC,
  title={Thermal Modeling, Characterization and Management of On-Chip Networks},
  author={Li Shang and Li-Shiuan Peh and Amit Kumar and Niraj K. Jha},
  journal={37th International Symposium on Microarchitecture (MICRO-37'04)},
  year={2004},
  pages={67-78}
}
Due to the wire delay constraints in deep submicron technology and increasing demand for on-chip bandwidth, networks are becoming the pervasive interconnect fabric to connect processing elements on chip. With ever-increasing power density and cooling costs, the thermal impact of on-chip networks needs to be urgently addressed. In this work, we first characterize the thermal profile of the MIT Raw chip. Our study shows networks having comparable thermal impact as the processing elements and… CONTINUE READING
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