Thermal Interface Materials

  title={Thermal Interface Materials},
  author={D. D. L. Chung},
  journal={Journal of Electronic Materials},
  • D. Chung
  • Published 21 October 2019
  • Engineering, Physics
  • Journal of Electronic Materials
Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink. This commentary is directed at clarifying some misconceptions related to the design and testing of TIMs. 

Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications

The development of integrated circuitry has resulted in cheaper and more efficient computers being available every year. Unfortunately, this development comes at the expense of an exponential

Integrated Copper Heat Spreaders in Glass Panel Embedded Packages with Near-Zero Thermal Interface Resistance

Ultra-thin, panel embedded packages in glass and laminate substrates with embedded copper heat-spreaders with near-zero thermal interface resistance are demonstrated for the first time. This unique

Influence of Finishing and Contact Pressure on Thermal Conduction of Thermoelectric Generator

  • Pedro H. G. GomesA. P. NetoA. AlvesW. Calixto
  • Materials Science, Engineering
    2018 IEEE International Conference on Environment and Electrical Engineering and 2018 IEEE Industrial and Commercial Power Systems Europe (EEEIC / I&CPS Europe)
  • 2018
The objective of this work is to analyze the influence of surface finishing quality and contact pressure in the efficiency of electrical conduction in thermoelectric generator (TEG) from laboratory

Thermal Conductivity Determination of Ga-In Alloys for Thermal Interface Materials Design

Thermal interface material (TIM) that exists in a liquid state at the service temperature enables efficient heat transfer across two adjacent surfaces in electronic applications. In this work, the

Chemical Modification of High Performance Metal-based Nanocomposite Thermal Interface Materials Toward Efficient Cooling in Electronic Systems

Overheating is a crucial problem limiting the reliability and performance of electronic systems. Since these systems have become continuously smaller, more powerful and sophisticated in recent

Application of Graphene Silicone Grease in heat dissipation for the Intel Core i5 Processor

Graphene was known as the material that owning many superiority properties and high thermal conductivity. Thermal conductivity of single-layer graphene was up to 5200 W/mK (compared to the thermal

Experiments on the thermal resistance of deformable thermal interface materials under mechanical loading

Experiments have been performed to characterize the thermal resistance of thermal interface materials that deform under mechanical loading. TIMs in this category include elastomeric silicon rubber

Low-Pressure-Assisted Large-Area (>800 mm2) Sintered-Silver Bonding for High-Power Electronic Packaging

Nanosilver paste, as a kind of new thermal interface material (TIM) with superior thermal performance, has the potential to be a replacement for the conventional TIMs, such as greases, gels, and

Characterization Methodology, Modeling, and Converter Design for 600 V Enhancement-Mode GaN FETs

Gallium Nitride (GaN) power devices are an emerging technology that have only become available commercially in the past few years. This new technology enables the design of converters at higher

Silicone Resin-Based Composite Materials for High Thermal Stability and Thermal Conductivity

Insulated silicone/alumina (Al 2 O 3 ) composites with high thermal stability and thermal conductivity were fabricated, in which the silicone resin was fabricated by a hydrolysis and condensation