Thermal Interface Materials

@article{Chung2019ThermalIM,
  title={Thermal Interface Materials},
  author={D. D. L. Chung},
  journal={Journal of Electronic Materials},
  year={2019},
  volume={49},
  pages={268-270}
}
  • D. Chung
  • Published 21 October 2019
  • Engineering, Physics
  • Journal of Electronic Materials
Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink. This commentary is directed at clarifying some misconceptions related to the design and testing of TIMs. 

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