Thermal Conductivity of Power Semiconductors—When Does It Matter?

@article{Boteler2019ThermalCO,
  title={Thermal Conductivity of Power Semiconductors—When Does It Matter?},
  author={Lauren Boteler and Aivars J. Lelis and Morris S. Berman and Michael C. Fish},
  journal={2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)},
  year={2019},
  pages={265-271},
  url={https://api.semanticscholar.org/CorpusID:211227341}
}
A study comparing the interaction between wide bandgap (WBG) materials, chip thickness, and heat sink selection on the total temperature rise in a standard power electronics package was performed. The thermal calculations, using the ARL ParaPower tool, showed that chips with thermal conductivities of less than 150 W/mK (including β-Ga2O3) had a dominant effect on total temperature rise, whereas thermal conductivities greater than 400 W/mK (including SiC and diamond) had little impact. In… 
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