Thermal Challenges in Next-Generation Electronic Systems

  title={Thermal Challenges in Next-Generation Electronic Systems},
  author={Yogendra K. Joshi and Suresh V. Garimella},
  journal={IEEE Transactions on Components and Packaging Technologies},
Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next… CONTINUE READING
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