Thermal/performance trade-off in network-on-chip architectures

  title={Thermal/performance trade-off in network-on-chip architectures},
  author={Davide Zoni and Simone Corbetta and William Fornaciari},
  journal={2012 International Symposium on System on Chip (SoC)},
Multi-core architectures are a promising paradigm to exploit the huge integration density reached by high-performance systems. Indeed, integration density and technology scaling are causing undesirable operating temperatures, having net impact on reduced reliability and increased cooling costs. Dynamic Thermal Management (DTM) approaches have been proposed in literature to control temperature profile at run-time, while design-time approaches generally provide floorplan-driven solutions to cope… CONTINUE READING