The van der Pauw stress sensor

@article{Mian2006TheVD,
  title={The van der Pauw stress sensor},
  author={Ahsan Mian and J. C. Suhling and R. P. Jaeger},
  journal={IEEE Sensors Journal},
  year={2006},
  volume={6},
  pages={340-356}
}
Piezoresistive sensors fabricated on (100) and (111) silicon surfaces are capable of measuring from four to all six components of the stress state at a point on the surface of an integrated circuit die. Such resistor-based sensors have been successfully designed and fabricated on these wafer planes and have been used successfully for measurement of die stresses in electronic packages by many research teams. In this paper, classical van der Pauw (VDP) structures, traditionally used for sheet… CONTINUE READING

Citations

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SHOWING 1-10 OF 29 CITATIONS

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  • 2016
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References

Publications referenced by this paper.
SHOWING 1-10 OF 41 REFERENCES

Determination of resistivity tensor and hall tensor of anisotropic conductors

  • Philips Res. Rep., vol. 16, pp. 187–195, 1961.
  • 1961
VIEW 4 EXCERPTS
HIGHLY INFLUENTIAL

Quasi-analytical study of offset voltage due to piezoresistive effect in vertical Hall devices by mapping techniques

  • TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)
  • 2003

Silicon piezoresistive stress sensors using MOS and bipolar transistors

R. C. Jaeger, J. C. Suhling, A. T. Bradley, J. Xu
  • Proc. Inter- PACK ASME EEP Conf., vol. 26, Jun. 13–19, 1999, pp. 219–226.
  • 1999
VIEW 1 EXCERPT

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