The use of monodispersed colloids in the polishing of copper and tantalum.

Abstract

The properties of abrasive particles play a significant role in chemical mechanical polishing (CMP) of metal and dielectric films in semiconductor device manufacturing. This study investigates the effects of the particle size, shape, and hardness of abrasives on the polishing of copper and tantalum films in the presence of different slurry chemistries. Well… (More)

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