The thermal benefits of diamond enhanced plastic packages for microwave applications

  • M. Gomes-Casseres
  • Published 1998 in
    1998 IEEE MTT-S International Microwave Symposium…
The superior material properties of diamond combined with the economics of plastic packaging provide the ultimate thermal management solution. A GaAs power amplifier dissipating 20 W has been demonstrated in a diamond enhanced plastic package. In addition, a dramatic improvement in the electrical performance of a coplanar flip chip MMIC in plastic has been… CONTINUE READING