The need for a full-chip and package thermal model for thermally optimized IC designs

@article{Huang2005TheNF,
  title={The need for a full-chip and package thermal model for thermally optimized IC designs},
  author={Wei Huang and Eric Humenay and Kevin Skadron and Mircea R. Stan},
  journal={ISLPED '05. Proceedings of the 2005 International Symposium on Low Power Electronics and Design, 2005.},
  year={2005},
  pages={245-250}
}
Modeling and analyzing detailed die temperature with a full-chip thermal model at early design stages is important to discover and avoid potential thermal hazards. However, omitting important aspects of package details in a thermal model can result in significant temperature estimation errors. In this paper, we discuss the applications of an existing compact thermal model that models both die and package temperature details. As an example, a thermally self-consistent leakage power calculation… CONTINUE READING
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