The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

  title={The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging},
  author={Carl Deppisch and Thomas Fitzgerald and Arun Raman and Fay Fremont Hua and Charles Zhang and Pilin Liu and Mikel R. Miller},
Developing new thermal interface materials (TIMs) is a key activity to meeting package thermal performance requirements for future generations of microprocessors. Indium solder is capable of demonstrating end-of-line performance to meet current technology targets due to its inherent high thermal conductivity. However, improving its reliability performance, particularly in temperature cycling, is a challenge. This study describes the failure mechanisms and reliability performance of indium… 
Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics
Purpose In microelectronics industry, the reliability of its components is a major area of concern for engineers. Therefore, it is imperative that such concerns are addressed by using the most
Fabrication and characterization of a metal matrix polymer fibre composite for thermal interface material applications
  • C. Zandén, Xin Luo, L. Ye, Johan Liu
  • Engineering, Materials Science
    19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
  • 2013
Dealing with increasing power densities in high performance micro- and power -electronics applications is continuously becoming more challenging. Many applications today need thermal interface
Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications
With increased power density and continued miniaturization, effective thermal dissipation is of significant importance for operational lifetime and reliability of electronic system. Advanced thermal
Evaluation of Thermal Characteristics of Board-level High Performance Flip-chip Package Equipped with Vapor Chamber as Heat Spreader
Thermal analysis was performed in this work to compare the thermal performance of a board-level high performance flip-chip ball grid array package equipped with solid Cu or vapor chamber (VC) as the
Thermal and thermo-mechanical performance of voided lead-free solder thermal interface materials for chip-scale packaged power device
The need to maximise thermal performance of electronic devices coupled with the continuing trends on miniaturization of electronic packages require innovative package designs for power devices and
Failure analysis of thermal degradation of TIM during power cycling
  • H. Zhang, S. Li, C. Lian
  • Engineering
    Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
  • 2014
This paper discusses a thermal reliability testing experiment and failure analysis (FA) in 32nm SOI Si technology chip packages. Thermal performance of the TIM materials is monitored and physical


Solders in electronics
The metallurgy and mechanical behaviour of the principal solder types based on lead-tin alloys are reviewed. Particular emphasis is placed upon their performance under simulated service conditions,
Interfacial reactions between liquid indium and Au-deposited substrates
The morphology and growth kinetics of intermetallic compounds formed during the soldering reactions of liquid indium on Au-deposited substrates in the temperature range of 225°C and 350°C have been
Journal of Surface Mount Technology
  • Journal of Surface Mount Technology
  • 2006
Electronic Assembly Having a Wetting Layer on a Thermally Conductive Heat Spreader
  • U.S. patent
  • 2003
  • 2000
Journal of Electronic Materials
  • Journal of Electronic Materials
  • 2000
Journal of Materials Science
  • Journal of Materials Science
  • 1996
MRS Bulletin December
  • MRS Bulletin December
  • 1993