The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

@article{Deppisch2006TheMO,
  title={The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging},
  author={Carl Deppisch and Thomas Fitzgerald and Arun Raman and Fay Fremont Hua and Charles Zhang and Pilin Liu and Mikel R. Miller},
  journal={JOM},
  year={2006},
  volume={58},
  pages={67-74}
}
Developing new thermal interface materials (TIMs) is a key activity to meeting package thermal performance requirements for future generations of microprocessors. Indium solder is capable of demonstrating end-of-line performance to meet current technology targets due to its inherent high thermal conductivity. However, improving its reliability performance, particularly in temperature cycling, is a challenge. This study describes the failure mechanisms and reliability performance of indium… 
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This paper discusses a thermal reliability testing experiment and failure analysis (FA) in 32nm SOI Si technology chip packages. Thermal performance of the TIM materials is monitored and physical
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