The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

@article{Deppisch2006TheMO,
  title={The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging},
  author={Carl Deppisch and Thomas Fitzgerald and Arun Raman and Fay Fremont Hua and Charles C. Zhang and Pilin Liu and Mikel R. Miller},
  journal={JOM},
  year={2006},
  volume={58},
  pages={67-74}
}
Developing new thermal interface materials (TIMs) is a key activity to meeting package thermal performance requirements for future generations of microprocessors. Indium solder is capable of demonstrating end-of-line performance to meet current technology targets due to its inherent high thermal conductivity. However, improving its reliability performance, particularly in temperature cycling, is a challenge. This study describes the failure mechanisms and reliability performance of indium… CONTINUE READING

Figures from this paper.

Citations

Publications citing this paper.
SHOWING 1-10 OF 26 CITATIONS

Flip Chip and Heat Spreader Attachment Development

VIEW 13 EXCERPTS
CITES BACKGROUND & METHODS
HIGHLY INFLUENCED

Electroplated copper nanowires as Thermal Interface Materials

  • 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
  • 2016
VIEW 1 EXCERPT
CITES BACKGROUND

Review of current progress of thermal interface materials for electronics thermal management applications

  • 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO)
  • 2016
VIEW 2 EXCERPTS
CITES METHODS

References

Publications referenced by this paper.
SHOWING 1-2 OF 2 REFERENCES

Electronic Assembly Having a Wetting Layer on a Thermally Conductive Heat Spreader,

C. L. Deppisch
  • U.S. patent 6,504,242
  • 2003