The leading edge of production wafer probe test technology

  title={The leading edge of production wafer probe test technology},
  author={William R. Mann and Frederick L. Taber and Philip W. Seitzer and Jerry J. Broz},
  journal={2004 International Conferce on Test},
Microelectronic wafer and die level testing have undergone significant changes in the past few years. This work's first section describes today's leading edge characteristics for numerous areas of this test technology including the minimum I/O pad pitch, advances in contactor technologies, maximum number of l/Os probed, maximum number of die tested in parallel, the largest prober and substrates, and the maximum frequencies being tested at the wafer level. The second section discuss the leading… CONTINUE READING
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