The influence of residual stress induced by anodic wafer bonding on MEMS membrane properties

Abstract

The bonding is one of the common processes performed during MEMS fabrication. It allows creating advanced microstructures and specific encapsulation. However, this process induces a residual stress into the structure as the annealing process is required. In this paper the bonding of silicon and pyrex glass is taken into account as these materials have… (More)

10 Figures and Tables

Topics

  • Presentations referencing similar topics