The future of gold in electronics

@article{Ellis2004TheFO,
  title={The future of gold in electronics},
  author={Timothy W. Ellis},
  journal={Gold Bulletin},
  year={2004},
  volume={37},
  pages={66-71}
}
  • T. Ellis
  • Published 1 March 2004
  • Materials Science
  • Gold Bulletin
Gold-based materials have been a mainstay of the electronics and semiconductor industry since the physics was just a laboratory curiosity. Gold is the workhorse material in wire bond, flip chip and off wafer interconnections due to its corrosion resistance, ability to form metallurgical bonds by soldering or cold welding, and ease of fabrication. As the electronics and semiconductor industries grew, so did the use, of gold in spite of the feature size reduction so elegantly demonstrated in… 
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