The formation and evolution of IMC and its effect on the solder joint properties

@article{Li2005TheFA,
  title={The formation and evolution of IMC and its effect on the solder joint properties},
  author={Xiao-yan Li and Ben-sheng Wu and Xiao-Hua Yang},
  journal={2005 6th International Conference on Electronic Packaging Technology},
  year={2005},
  pages={273-278}
}
This paper made a review of the kinds, morphology and distribution of intermetallic compound (IMC) formed in the bulk solder and at the solder-pad interface during reflow soldering of components and printed circuit boards, and then the formation or evolution of them was investigated after aging. The effect of IMC on the mechanical properties and fracture mechanism of the joint was also discussed in this paper. The results show that during the soldering, the kinds of IMCs are controlled by the… CONTINUE READING
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