The flip-chip approach for millimeter wave packaging

@article{Heinrich2005TheFA,
  title={The flip-chip approach for millimeter wave packaging},
  author={Wolfgang Heinrich},
  journal={IEEE Microwave Magazine},
  year={2005},
  volume={6},
  pages={36-45}
}
A particularly critical issue in this regard is module packaging, i.e., the way to assemble and connect several monolithic microwave integrated circuits (MMICs) in a multichip environment in order to build the millimeter-wave front-end. The requirements on the packaging scheme are obvious: the interconnects should provide good millimeter-wave performance… CONTINUE READING

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