The effects of temperature and aging on Young's moduli of polymeric based flexible substrates

@inproceedings{Li2000TheEO,
  title={The effects of temperature and aging on Young's moduli of polymeric based flexible substrates},
  author={Ron Li and Jianqiang Jiao},
  year={2000}
}
Polymeric based flexible substrates are widely used as bendable Printed Circuit Boards in automotive and other electronic systems for easy interconnection and processing. Their flexibility however brings issues such as high dynamic stresses and dynamic fatigue associated with structural instability. Stress analysis and fatigue prediction requires fundamental understanding of thermal mechanical properties of these materials. This paper specifically studies the effects of temperature and aging on… CONTINUE READING

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