The effect of polymer hardness, pore size, and porosity on the performance of thermoplastic polyurethane-based chemical mechanical polishing pads

@article{Prasad2013TheEO,
  title={The effect of polymer hardness, pore size, and porosity on the performance of thermoplastic polyurethane-based chemical mechanical polishing pads},
  author={Abaneshwar Prasad and George P. Fotou and Shoutian Li},
  journal={Journal of Materials Research},
  year={2013},
  volume={28},
  pages={2380-2393}
}
Solid-state microcellular foaming (SSMF) process was used to produce porous chemical mechanical polishing (CMP) pads in a variety of pore size and porosity range, using a variety of thermoplastic polyurethane (TPU) resin hardness. By controlling the pore size, porosity, and pad hardness, one is able to manufacture CMP pads that offer tunable pad properties. A brief introduction to the SSMF manufacturing process and thereby, unique microstructures created is first addressed followed by inner… 

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