The availability of the thermal resistance model in flip-chip packages

@article{Lee2007TheAO,
  title={The availability of the thermal resistance model in flip-chip packages},
  author={Woong Sun Lee and Kwang Yoo Byun},
  journal={2007 International Conference on Electronic Materials and Packaging},
  year={2007},
  pages={1-5}
}
Thermal resistance model is very simple and good tool for thermal analysis of package system. In this study, thermal resistance model was compared with simulation tool and real measurement values of flip-chip package which was made by using DTSA (Diode Temperature Sensor Array). Especially, a micro thermocouple sensor array - DTSA - has been developed to investigate the temperature distributions of underfill in flip-chip package. Various fillers were used with underfill resin system, silica… CONTINUE READING
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