A Fine-Grain, High-Throughput Archi tecture Using Through-Wafer Optical Interconnect
- W. Stephen Lacy, Christophe Camperi-Ginestet, Brent Buchanan, D. Scott Wills, Nan Marie Jokerst, Martin Brooke
- In Proceedings of First Annual Workshop on…
This paper introduces a new network topology, the ooset-cube, for three-dimensional image processing systems. It provides general node-to-node communications for random message traac with an average latency that is comparable to a k-ary 3-cube. It is well suited for communication patterns common in image processing applications (e.g., image scaling, overlapping segmentation). The ooset-cube topology provides an extremely compact, through-wafer implementation employing integrated optoelectronic devices. This paper describes work in progress towards the examination of this new topology and its implementation including architectural issues (e.g, oblivious and adaptive minimal routing algorithms, performance analysis with random traac and trace-driven workloads, comparison with k-ary 3-cubes), plus implementation issues in building a scalable system.