The International Roadmap for Semiconductors 2007

  title={The International Roadmap for Semiconductors 2007},
  author={Bill Bottoms},
  journal={2007 8th International Conference on Electronic Packaging Technology},
  • Bill Bottoms
  • Published 2007 in
    2007 8th International Conference on Electronic…
The international roadmap for semiconductors will have major revisions for 2007 when it is published in December. In 2007 there will be a major rewrite of the ITRS with important changes in every chapter. The assembly and packaging chapter is the integrator of components from all other working groups. A result of tins integration role is that progress in each area is both enabling and demanding significant change in the way we assemble and package semiconductors to deliver solutions to a… CONTINUE READING