The Influence of Skin Effect on Via-Vicinity-Interfaces Current Density of Cu Interconnects

@inproceedings{Yao2012TheIO,
  title={The Influence of Skin Effect on Via-Vicinity-Interfaces Current Density of Cu Interconnects},
  author={Ming Yao and Xu Zhang},
  year={2012}
}
This paper presents a research on skin effect’s influence on the current density distribution of Cu/barrier layer and Cu/cap layer interfaces of copper interconnects’ via vicinities. A two-level Cu-interconnect structure in different positional relationships with the ground plane is discussed. Through the three-dimensional (3D) finite element simulation of the interconnect structure, the variations of current density on three important surface areas are obtained when skin effect is significant… CONTINUE READING