The Formation Rule and Controlling Method of Intermetallic Compounds in Al/Cu Bonding System

@inproceedings{Ann2013TheFR,
  title={The Formation Rule and Controlling Method of Intermetallic Compounds in Al/Cu Bonding System},
  author={Yue Ann},
  year={2013}
}
The formation of intermetallic compounds(IMC)on the Al/Cu bonding interface is an important factor leading to the failure of microelectronic components.The IMC growth rule on the interface during the process of welding and application is summarized,and the failure mechanisms of Al/Cu bonding system is analyzed.During thermosonic bonding process,alumina fragmentation make the formation of IMC become possible,the IMC and Kirkendall void ultimately lead bonding failure.The diffusion rate of Cu… CONTINUE READING