The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability

@article{Rodekohr2010TheEO,
  title={The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability},
  author={C. L. Rodekohr and Michael J. Bozack and George T. Flowers and Jeffrey C. Suhling and D. A. Rodekohr},
  journal={2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts},
  year={2010},
  pages={1-5}
}
NA 

From This Paper

Figures, tables, results, connections, and topics extracted from this paper.
1 Extracted Citations
8 Extracted References
Similar Papers

Referenced Papers

Publications referenced by this paper.
Showing 1-8 of 8 references

Adhesion of Thin Films

  • M. H. Chen, H. M. Jao, T. L. Liao
  • Vacuum Technology & Coating
  • 2004

Correlation between Intermetallic Thickness and Roughness during Solder Reflow

  • S. Lahiri Zuruzi, P. Burman, K. Siow
  • Journal of Electronic Materials
  • 2001

Roughness evolution of Cu 6 Sn 5 Intermetallic During Soldering

  • C. Chiu Zuruzi, S. Lahiri
  • Journal of Applied Physics
  • 1999

Effect of Interface Roughness on Fatigue Crack Growth in Sn - Pb Solder Joints

  • J. A. Sees Y. Wu, C. Pouraghabagher, L. A. Foster, J. L. Marshall, E. G. Jacobs, R. F. Pinizzotto
  • Journal of Electronic Packaging
  • 1996

The Effect of Substrate Surface Roughness on the Fracture Toughness of Cu / 96 . 5 Sn - 4 . 5 Ag Solder Joints

  • R. E. Pratt Stromswold, D. J. Quesnel
  • Journal of Electronic Materials
  • 1994

Reliability Issues in Pb - Free Solder Joint Miniaturization

  • E. Jung, R. Thomson, C. Liu, T. Loeher, M. Minkus

The Formation and Growth of Intermetallics in Composite Solder

  • T. Sritharan
  • Journal of Electronic Materials

Three - Dimensional Morphology of a Very Rough Interface Formed in the Soldering Reaction between Eutectic SnPb and Cu

  • K. N. Tu
  • Applied Physics Letters

Similar Papers

Loading similar papers…