The 2021 flexible and printed electronics roadmap

@article{Bonnassieux2021The2F,
  title={The 2021 flexible and printed electronics roadmap},
  author={Yvan Bonnassieux and Christoph J. Brabec and Yong Cao and Tricia Breen Carmichael and Michael L. Chabinyc and Kwang-Ting Cheng and Gyoujin Cho and Anjung Chung and Corie Lynn Cobb and Andreas Distler and Hans-J. Egelhaaf and Gerd Grau and Xiaojun Guo and Ghazaleh Haghiashtiani and Tsung-Ching Huang and Muhammad. M. Hussain and Benjam{\'i}n I{\~n}{\'i}guez and Taik-Min Lee and Ling Li and Yuguang Ma and Dong-ge Ma and Michael C. McAlpine and Tse Nga Ng and Ronald {\"O}sterbacka and Shrayesh N. Patel and Junbiao Peng and Huisheng Peng and Jonathan Rivnay and Leilai Shao and Daniel A. Steingart and Robert A. Street and Vivek Subramanian and Luisa Torsi and Yunyun Wu},
  journal={Flexible and Printed Electronics},
  year={2021},
  volume={6}
}
This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific… 
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